We believe that a little can be done to the "Heat-Sink" component of cooling (Limitation of "material properties" or Space) and it's optimization reaches the saturation point quickly, However the "Fan" component can still be enhanced as flow-rate can/should be of more importance in cooling.

Easier said than done, the fan flow rate improvement will require the optimization of various factors e.g. blade-shape, Number of blades, Fan dimensions, RPM, Noise etc. where each of these parameters can also be interdependent.

Currently we are doing a research on improvement in fan's (Fluid moving device's) performance in terms of its Flow-delivery and Noise. 


The research will be conducted in two stages. If you are interested to collaborate with us, drop us an email. Once we have developed a confidence in our first stage of research, we shall contact you.


​

1) What is the InnoFan Project?

The InnoFan Project is InnoMech's flagship project wherein we are working on Innovative fan development which can be utilized in the electrical/ electronics industry.

2) What is the Context?

Experts in Electronics Cooling India

3) Why InnoFan Project?

In electronics industry today, there are two major components of cooling i.e. "Heat-Sink" and "Fan" (Not considering natural convection situations). 


​In most of the cooling situations Air is deemed/ desired as a fluid for cooling (as Liquid cooling is expensive) and a Fan acts as a fluid-moving device.

As we all know that the Power dissipation = h *A * Delta(T). And the "Heat-Sink" is used to increase the Area whereas "Fan" is used to increase h (Heat transfer coefficient). The increase in h is in-turn dependent on velocity/ air-flow and hence on the fluid-movement capability of a Fan.

Now, the heat dissipation from a heat-sink can either be increased by increasing the Surface area or by increasing the flow-rate through it. However, increasing the surface area has a disadvantage that it adds an extra pressure-drop which reduces the flow-rate and thus reduces the heat dissipation!

So, There is a clear trade-off between the surface-area and the flow-rate and eventually the pressure-drop "Dictates" the heat dissipation. In other words the heat sink design which tries to reduce the pressure-drop "Wins". One must remember however that in a real electronic system pressure drop cannot be reduced after a certain point but on the contrary a Fan can be improved which can give a better flow at a same pressure-drop level.