We believe that a little can be done to the "Heat-Sink" component of cooling (Limitation of "material properties" or Space) and it's optimization reaches the saturation point quickly, However the "Fan" component can still be enhanced as flow-rate can/should be of more importance in cooling.

Easier said than done, the fan flow rate improvement will require the optimization of various factors e.g. blade-shape, Number of blades, Fan dimensions, RPM, Noise etc. where each of these parameters can also be interdependent.

Currently we are doing a research on improvement in fan's (Fluid moving device's) performance in terms of its Flow-delivery and Noise. 

The research will be conducted in two stages. If you are interested to collaborate with us, drop us an email. Once we have developed a confidence in our first stage of research, we shall contact you.

1) What is the InnoFan Project?

The InnoFan Project is InnoMech's flagship project wherein we are working on Innovative fan development which can be utilized in the electrical/ electronics industry.

2) What is the Context?

Experts in Electronics Cooling India

3) Why InnoFan Project?

In electronics industry today, there are two major components of cooling i.e. "Heat-Sink" and "Fan" (Not considering natural convection situations). 

​In most of the cooling situations Air is deemed/ desired as a fluid for cooling (as Liquid cooling is expensive) and a Fan acts as a fluid-moving device.

As we all know that the Power dissipation = h *A * Delta(T). And the "Heat-Sink" is used to increase the Area whereas "Fan" is used to increase h (Heat transfer coefficient). The increase in h is in-turn dependent on velocity/ air-flow and hence on the fluid-movement capability of a Fan.

Now, the heat dissipation from a heat-sink can either be increased by increasing the Surface area or by increasing the flow-rate through it. However, increasing the surface area has a disadvantage that it adds an extra pressure-drop which reduces the flow-rate and thus reduces the heat dissipation!

So, There is a clear trade-off between the surface-area and the flow-rate and eventually the pressure-drop "Dictates" the heat dissipation. In other words the heat sink design which tries to reduce the pressure-drop "Wins". One must remember however that in a real electronic system pressure drop cannot be reduced after a certain point but on the contrary a Fan can be improved which can give a better flow at a same pressure-drop level.