InnoMech Technologies Pvt. Ltd.
Experts in Electronics Cooling India
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions.
There are several techniques for cooling including various styles of heat sinks, thermo-electric coolers, forced air systems and fans, heat pipes, and others.
Due to recent technological developments and public interest, the retail heat-sink market has reached an all-time high. In the early 2000s, CPUs were produced that emitted more and more heat than earlier, escalating requirements for quality cooling systems.
Thermal Design is thus required to make robust electronic products. There are three major components of thermal design:
1) Thermal Technology selection and its development for a specific product.
2) Thermal Simulation of the product using CAE to detect problem areas before going into prototyping. Simulation helps a designer by giving visual representation of temperature and flow inside a system.
3) An iterative thermal improvement by making mechanical changes in the product, which requires a knowledge of component manufacture-ability also. These mechanical changes can be on electronics-chassis level, board level or component heat sink level.
Please refer our product portfolio for the thermal design services that we offer in different industrial domains.